Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution

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  • Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
  • Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
  • Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
  • Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
  • Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
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  • Overview
  • Product Description
  • Highlights
  • Specification
  • Application Areas
  • Company Profile
  • Packing & Delivery
  • Our Clients
  • FAQ
Overview

Basic Info.

Model NO.
YT-2353
Application
Home Appliance, Petroleum Machinery Manufacturing, Aerospace Industry, Automotive Industry, Optical Industry, Glass Industry, Zirconia/Ruby.
Cooling System
Water Cooling
Technical Class
Pulse Laser
Applicable Material
Nonmetal
Structure Type
Gantry Type
Laser Classification
Solid Laser
Laser Technology
Ultrafast Laser
OEM&ODM
Accepted
Certificate
CE,ISO9001
Transport Package
Wooden Box
Specification
1600*1900*2000mm
Trademark
INTE
Origin
China
Production Capacity
100sets/Month

Packaging & Delivery

Package Size
200.00cm * 230.00cm * 240.00cm
Package Gross Weight
3700.000kg

Product Description

Product Description
Infrared Sub-picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Model: YT-2-353 Dual-Head Laser Zirconia Cutting Equipment
Industry: Jewelry & Gemstone Manufacturing
Designed specifically for jewelry manufacturers and gemstone producers seeking to scale production, our Dual-Head Infrared Sub-picosecond Laser Zirconia Cutting Machine revolutionizes the way you cut zirconia, diamonds, and other precious stones. Say goodbye to the limitations of traditional wire cutting—this equipment delivers unmatched efficiency, precision, and yield to meet the demands of high-volume orders.
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Highlights
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Exceptional Material Yield (Save Costs)
Eco-Friendly & Low Maintenance
Versatile Shaping Capabilities
The YT-2-353 optimizes the cutting path to minimize kerf loss. The finished stone yield rate is over 30% higher compared to traditional wire cutting. This means more sellable products from the same raw material, significantly boosting your profit margins.
Say goodbye to the mess of wire cutting. Our laser process is pollution-free with minimal consumables. The easy-to-operate industrial software platform ensures stable operation and reduces the need for complex maintenance.
Go beyond standard cuts. Our dual-platform integrated system handles materials up to 3mm thickness, effortlessly processing complex shapes such as Oval, Pear, Round, Tapered Baguette, and Marquise. Ideal for custom jewelry designs.
Ultra-Fast Processing Speed
Equipped with a high-precision motion platform and a high-peak-power infrared sub-picosecond laser, it achieves ultra-fast cutting. The dual-head design doubles the efficiency, making it perfect for large-volume orders.
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Integrated Configuration 
Includes: 4-Head Splitting Equipment
Simultaneous Splitting: Features four splitting heads performing linear splitting at the same time, significantly enhancing post-processing efficiency.

Precision Thickness Control: Zirconia after laser cutting can be split into various precise thicknesses via the splitting equipment.
Smart Control: Comes with an easy-to-operate industrial software platform, streamlining the workflow from cutting to splitting.
Specification
Laser Type
Infrared Sub-picosecond Laser
Processing Area
600mm x 600mm (Customizable)
Machine Dimensions
1650mm x 1950mm x 2000mm (Prevail in kind)
Processing Accuracy
± 0.02mm
Total Power Consumption
6.5 KW
Machine Weight
3500 KG
Working Voltage
AC380V
Environment Requirements
Temperature: 22°C ± 2°C;
Humidity: 30%~60% (Non-condensing)
Application Areas
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Ideal for cutting and shaping:
Synthetic Gemstone Manufacturing: High-volume cutting of Cubic Zirconia (CZ), Moissanite, etc.
Custom Jewelry Design: Rapid prototyping and production of unique gem shapes.
Industrial Ceramics Processing: Precise cutting of similar brittle hard materials.
Why Choose Inte Laser?
Proven Efficiency: 30%+ yield rate boost vs. traditional methods.
Advanced Technology: Sub-picosecond laser + dual-head design for speed and precision.
Versatility: Custom shapes and integrated splitting for end-to-end processing.
Sustainability: Eco-friendly process with low maintenance.
Company Profile
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
INTE Laser is a technology-oriented enterprise that specializes in the
independent research and development of laser generators, optical devices,equipment application processes and technologies, and integration of automation systems.It is a four-dimensional integrated equipment manufacturing company.
We provide innovative solutions for laser micromachining applications,including processing technology,processing techniques,laser sources and optical systems, application equipment,technical support, and services.
Create values for clients in industries such as printed circuit boards, consumer electronics,semiconductors,glass,new energy power batteries,and solar energy.
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Shenzhen Headquarters (R&D Center)
Suzhou Subsidiary (Sales + After- Sales) service
Suqian Subsidiary (Production Base)



Research and Development Team

Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Mechanical Design and R&D Center
Laser R&D Center
R&D Laboratory



Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution

Packing & Delivery
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Packing& Shipping & Delivery 
Packing:
1PCS/Wooden Case
Shipping Method:

Shipping by sea or by express, considerating the packed goods are too heavy, shipping by sea is more considerable, when goods urgently need, international express is more suitable for you.
 
Delivery Time:
For standard goods about 30-45 days after order confirmed and get order deposit.
For customized goods about 45-60 days after order confirmed and get order deposit.
Our Clients
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
FAQ

Q: How much material can I save compared to wire cutting?
A: You can expect a finished stone yield rate increase of over 30%, which is a massive cost saving for high-value materials.
Q: Can this machine cut shapes other than round?
A: Yes, it excels at custom shapes including pear, marquise, tapered baguette, and oval for materials under 3mm thickness.
Q: Is it difficult to operate?
A: No, we feature an easy-to-operate industrial software platform designed to streamline your workflow and improve quality.

Ready to upgrade your production line? Send us an inquiry now for a quote or a live demonstration of the YT-2-353.
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution

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