Breakthrough 4-Head Laser Drilling Equipment: Industry-First Simultaneous Processing for PCB & Battery Separator Manufacturing

• Customization: Available
• After-sales Service: 12 Months
• Warranty: 12 Months
• Structure: Laser Drilling Machine
• Layout: Vertical
• Controlling Mode: Artificial
• Number of Shaft: Multi-Axis
• Hole Diameter: <50mm
• Automatic Grade: Automatic
• Precision: High Precision
• Certification: CE, RoHS, ISO 9001
• Condition: New
• OEM&ODM: Accepted
• Certificate: ISO9001, CE, RoHS
• Sample: Available
• Number of Laser Heads: 4 Heads (Synchronous/Independent)
• Application: HDI PCB, FPC, IC Substrate, Ceramic
• Processing Materials: Copper Clad Laminate, Fr4, Polyimide, Glass Epoxy
• Laser Type: Nanosecond UV, Picosecond UV, Picosecond Green Las
• Software Compatibility: Autocad, Gerber, Dxf Import
• Key Innovation: Industry-First 4-Head Synchronous Technology
• Efficiency Boost: 300% Higher Output Than Single-Head
• Market Positioning: High-End Electronics Manufacturing
• Transport Package: Wooden Case
• Specification: 7200mm×2300mm×2250mm
• Trademark: INTE
• Origin: China
• Production Capacity: 100sets/Month
• Package Size: 760.00cm * 270.00cm * 265.00cm
• Package Gross Weight: 8400.000kg

Product Description

Breakthrough 4-Head Laser Drilling Equipment: Industry-First Simultaneous Processing for PCB & Battery Separator Manufacturing 

Product Description

In the fast-paced world of electronics manufacturing, speed, precision, and versatility are paramount. The INTE Laser 4-Head Roll-to-Roll Laser Drilling Machine is engineered to meet these demands, delivering a 4x increase in throughput for high-volume production of HDI PCBs, FPCs, and other advanced materials. By integrating four independent high-precision laser heads with advanced roll-to-roll automation, this system is not just a equipment—it's a complete solution for boosting your production capacity, reducing per-unit costs, and securing your competitive edge in the global market.

Highlights

1. Revolutionize Your Production with Unmatched Efficiency

Industry's first 4-head roll-to-roll/roll-to-sheet laser drilling equipment delivers 4× higher output than single-head machines—cutting production time by 75% and boosting daily capacity from 1,000 to 4,000 pieces. Perfect for meeting surging demand in large scale HDI PCB and FPC manufacturing.

Key Features & Advantages (The Core Selling Points)

Technical Breakthroughs That Solve Industry Pain Points

Pioneering 4-Head Design: Breaks the efficiency bottleneck of traditional single-head equipment, enabling "one feed, four outputs" for massive productivity gains.

Feature	Advantages	Benefit to your business
4-Head Synchronous Processing	Four galvo scanners work simultaneously on a single workpiece.	Massive 4X Efficiency Boost: Dramatically increase output and meet tight deadlines for large orders.
Roll-to-Roll / Roll-to-Sheet/Sheet-to-sheet Flexibility	Seamlessly handles both continuous rolls and individual sheets.	One Machine, Multiple Applications:Maximize ROI by serving diverse markets (HDI, FPC, PCB) with one investment.
±0.02mm Ultra-High Precision	Equipped with high-resolution servo motors and advanced CCD vision positioning.	Zero-Defect Production:Meet the stringent tolerances of next-gen electronics, reduce scrap, and ensure premium quality.
Picosecond UV Laser Source	“Cold” ablation process with an extremely small heat-affected zone (HAZ).	Superior Hole Quality:No burrs, cracks, or thermal damage. Perfect for delicate materials like polyimide and glass.
Optimized Process (Plasma-Free)	Laser parameters are fine-tuned to eliminate the need for post-drilling plasma treatment.	Lower Operating Costs:Reduce process steps, save on consumables, and simplify your production line.
Intelligent Control System	User-friendly software with customizable parameters and remote monitoring capabilities.	Easy Operation & Monitoring:Reduce training time and maintain control over production from anywhere.

Picosecond Laser Innovation: 

Plasma-Free Process Optimization:

Uses picosecond UV/green laser to drill lithium battery separators with no burrs, no heat damage—hole edge smoothness improves 50%, extending battery cycle life by 30%.

(Compare: Traditional nanosecond laser (left) vs. our picosecond laser (right) for separator holes.)

 First "laser+process synergy" solution to eliminate plasma treatment—reduces 30% production steps, cuts maintenance costs by 40%.

(Simplified flowchart: Roll-to-roll → Laser drilling → Direct copper plating, no plasma step.)

Specification

Product Name	Breakthrough 4-Head Laser Drilling Equipment: Industry-First Simultaneous Processing for PCB & Battery Separator Manufacturing
Laser Type	Nanosecond UV, Picosecond UV, Picosecond green laser
Processing area	550mm×1500mm (customized)
Machine size	7200mm×2300mm×2250mm (Equipment with Upper and Lower Coil Material)
Machine processing accuracy	±0.02mm
Electric power loading	Main Unit +30kW Chiller +7kW Exhaust Fan +11kW
Machine weight	8000KG
Environment requirements	Humidity: 40% - 60% no condensation; Temperature: 22℃±2

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Company Profile

INTE Laser Founded in 2013, it is a technology-oriented enterprise that

specializes in the independent research and development of laser generators,optical devices,equipment application processes and technologies, and integration of automation systems.It is a four-dimensional integrated equipment manufacturing company.

We provide innovative solutions for laser micromachining applications,including processing technology,processing techniques,laser sources and optical systems, application equipment,technical support, and services.Create values for clients in industries such as printed circuit boards, consumer electronics,semiconductors,glass,new energy power batteries,and solar energy.

Shenzhen Headquarters (R&D Center)

Suzhou Subsidiary (Sales + After- Sales) service

Suqian Subsidiary (Production Base)

Research and Development Team

Mechanical Design and R&D Center

Laser R&D Center

R&D Laboratory

Application Areas

PCB Industry

• HDI PCBs, Multi-layer Boards 

• High-speed through-hole & blind via drilling

Flexible Circuits

• FPC, Flex-Rigid Boards 

• Polyimide cutting & drilling

Semiconductor 

• IC Substrates, Lead Frames 

• Ultra-fine micro-vias (≤0.05mm)

Consumer Electronics 

• Smartphones, Wearables

• Mass production solutions

Packing & Delivery

Packing& Shipping & Delivery 

Packing:1PCS/Wooden Case
Shipping Method:

By sea or by express, considerating the packed goods are too heavy, shipping by sea is more considerable, when goods urgently need, international express is more suitable for you.
Delivery Time:
For standard goods about 30-45 days after order confirmed and get order deposit.
For customized goods about 45-90 days after order confirmed and get order deposit.

FAQ

Q1: What is the advantage of 4-head synchronous drilling?
A: Our 4-head technology enables parallel processing, quadrupling throughput for HDI PCBs and Flexible Circuits (FPC) while significantly reducing cycle time.

Q2: What is the accuracy?
A: The system features a positioning accuracy of ±0.02mm and ±0.01mm repeatability, ensuring precise micro-vias and blind holes at high speeds.

Q3: What materials can it process?
A: Compatible with FR4, rigid PCBs, Flexible PCBs (FPC), polyimide, ceramic substrates, and copper clad laminates.

Q4: Does it support blind vias and buried vias?
A: Yes, it handles blind via drilling (BVB), buried vias, and through-holes with minimal Heat Affected Zone (HAZ) for clean sidewalls.

Q5: Is it automated?
A: Yes, it features CCD Vision Alignment and automated loading with real-time distortion correction for flexible boards.

Q6: Is beam quality consistent across all heads?
A: Our beam splitting technology ensures uniform energy distribution across all 4 heads, guaranteeing consistent hole quality.

Q7: What after-sales support is provided?
A: Includes comprehensive warranty, online technical training, installation assistance, and spare parts for 24/7 continuous operation.

Our Clients